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Intamsys FUNMAT PRO 410 HT 3D printer +PEEK ~ max. 406mm


  • Price on Application

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FUNMAT Pro 410 Dual-Head 3D Printer from Intamsys

At last, an affordable 3D printer that can print the high temperature polymers inc. PEEK.


With a heated chamber, heated bed and extruder temperatures up to 500 deg C, the Funmat Pro 410 is ideal for printing engineering and high-temp materials including PEEK.

Sealed filament drawer

Overall sealing design, built-in hygroscopic molecular sieve, reusable, with temperature and humidity monitoring, maintains below 10% RH of over 15 days. 2 Spools, overall sealed design with molecular sieve dehumidification. Built-in temperature and humidity monitoring sensor.

Molecular sieve drying process

Open the cover of the box, take out drying unit, put it into drying oven (200°C), and dry it for 2 hours (it can also be dried for a longer time); wear high-temperature resistant gloves (beware of burns), take drying unit out from oven, after cooling to room temperature, put it back to the filament drawer. Humidity of indicator > 20%, then the molecular sieve needs to be dried.

The Funmat Pro 410 3D printer has the following unique system attributes:-

  • Ability to print in PEEK, PEKK, PSU, PPSU and other high-performance materials
  • + ABS, ASA, PC-ABS, PP, PETG, Nylon, CF-PA and more
  • High temperature Nozzle that can be heated up to 500℃
  • Platform temperature up to 160℃
  • Chamber temperature up to 90℃
  • Open source high-performance engineering materials
  • Auto-bed levelling
  • Filament loading drivers
  • Ceramic glass build plate
  • Amazing value for money (for high temperature printing)
    Model Funmat Pro 410
    Printing Technology Fused Filament Fabrication (FFF)
    Build Volume 305 x 305 x 406mm
    Build Platform Aluminium Plate + Ceramic Glass
    Layer Thickness 50 to 300 microns
    Print Speed up to 300mm/s
    Extruder Temperature 500℃
    Platform Temperature 160℃
    Chamber Temperature 90℃
    Filament Diameter 1.75mm
    Position Accuracy X/Y:12.5μm Z:1.25μm
    Input File Type STL, OBJ
    Material PEEK, PEKK, PEI ULTEM, PSU, PPSU, PA/CF, PC, PC Alloys, PA, ABS, Carbon-filled, Metal-filled, Glass-filled, ASA, PETG, ESD-Safe, HIPS, TPU, PLA, PVA.


    INTAMSYS = INTelligent Additive Manufacturing SYStems



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